Microcontrollers (MCUs) are low-weight, high-value goods, but the documentation risk sits in part number, IC architecture, wafer/die origin, cryptographic capability and end-use. Confusing an MCU with a module, SoC, memory IC or development board can change HS classification, origin treatment and strategic-trade screening.

This guide scopes packaged processor/controller ICs, researches commercially relevant markets using 2023 data, then connects Market Access with HS, FTA/origin, semiconductor traceability, ESD/MSL packing, Cargo Ready, cut-offs and post-shipment records.

Market basis: WTO/UN Comtrade 2023 for HS 2022 854231 and WITS/UN Comtrade 2023 for broader HS H0 8542 (HS 1988/92). The datasets use different nomenclatures; WITS 8542 is only an IC-family routing signal, not MCU-only partner statistics and not a substitute for current 8-digit HS classification.

1. QUICK FACTS

MARKETS

China · Hong Kong · United States · Netherlands/EU

WTO reports Vietnam’s 2023 exports of HS 854231 at about US$10.634 billion. WITS for the broader 8542 IC family points to China, Hong Kong, the US and the Netherlands as the largest routes.

VIETNAM POLICY

A standard MCU must not automatically be treated as a licensed item. Secure/crypto, high-performance or sensitive-end-use parts require strategic-trade screening against the rules in force.

HS – DUTY – VAT

Reference HS 8542.31.00

For processor/controller integrated circuits. Modules, dev boards, memory ICs, amplifier ICs and unfinished parts require separate classification.

ORIGIN / FTA

China: RCEP/ACFTA. Hong Kong: AHKFTA/Form AHK. Netherlands/EU: EVFTA. The United States has no bilateral preferential FTA with Vietnam.

SPECIALIZED

Main controls are strategic-trade screening, substance/compliance evidence and buyer qualification. AEC-Q100, JEDEC, PPAP or buyer manuals are not Vietnam export permits.

ETD / CUT-OFF

Lock exact part, revision, package, origin, lot/date code, compliance file and packing before Cargo Ready. Air uses cargo-acceptance/AWB cut-offs; Sea uses CFS/SI/VGM where relevant.

TRANSPORT

Air/express is common for high-value, low-weight semiconductors. Control ESD, moisture barrier, tray/tape-reel, desiccant/HIC and MSL requirements.

QUICK GLOSSARY: MCU = microcontroller; SoC = system-on-chip; die = unpackaged semiconductor die; wafer = semiconductor wafer; OSAT = outsourced semiconductor assembly and test; ESD = electrostatic discharge; MSL = moisture sensitivity level; PSR = product-specific rule; CTSH = change in tariff subheading; RVC = regional value content; FDP rule = U.S. EAR foreign-direct-product rule.

2. SCOPE & MICROCONTROLLER CLASSIFICATION

Main scope: complete packaged microcontroller ICs with a processor/controller core and potentially integrated memory, converters, logic, clocks/timers and peripherals. The word “MCU” alone is insufficient to determine HS or export-control status.

Variant	What to check	Evidence	Possible HS/control	Application note
Packaged MCU IC	Processor/controller core; QFN/BGA/LQFP package; flash/RAM/peripherals	Datasheet, block diagram, package drawing, part number	Review 8542.31.00; strategic screen by spec/end-use	Main scope.
Secure / crypto MCU	Hardware crypto, secure element, key storage, trusted execution	Security datasheet, function statement, supplier ECCN if available	HS may remain 8542.31; export-control analysis is deeper	HS ≠ export-control classification.
Wireless MCU / RF SoC	Integrated RF transceiver, Bluetooth, Wi-Fi, Zigbee	RF block, band/power, SoC architecture	Classify by actual IC; destination radio requirements usually differ for bare IC vs finished RF module	Separate IC from module with antenna/crystal/shield.
Microprocessor / application processor	CPU-oriented, external memory, OS-capable	Architecture, memory interface	May still fall in 8542.31, but commercial/technical scope differs	Do not call every processor an MCU.
Memory IC	Storage is the principal function	Memory type/capacity	8542.32	Separate from MCU.
Amplifier / other IC	Amplification or other IC function	Datasheet	8542.33 / 8542.39	Separate conclusion.
Bare die / wafer	Unpackaged stage	Process flow, wafer map, die status	Classify by actual stage/current nomenclature	Do not copy finished-IC HS.
Development board / module	MCU on PCB with connectors/RF/power/peripherals	BOM, schematic, board function	Do not default to IC HS; classify the board/module function	Separate article if compliance logic changes.

MASTER DATA: manufacturer → part number → silicon revision → package → core/architecture → clock/performance → memory → peripherals → crypto/security → RF → temperature/automotive grade → wafer fab → assembly/test site → country of origin → lot/date code → end-use/end-user.

3. EXPORT MARKETS & MARKET ACCESS

3.1. MARKET SCAN – DATA FIRST

WTO Tariff & Trade Data reports Vietnam’s 2023 exports under HS 2022 854231 at about US$10.6342 billion. WITS/UN Comtrade for the broader 8542 IC family records about US$12.2714 billion, with China about US$5.6736bn, Hong Kong US$3.0775bn, the United States US$760.9m and the Netherlands US$505.1m. Because the partner figures are HS 8542 family data, they are route signal data, not MCU-only trade values.

Market	Trade signal	Fit	Market-access condition	Product/business requirement	Documents/data
China	Largest 8542 route from Vietnam in 2023	High	Review customs/HS and China RoHS under MIIT Order No.32. Official FAQ states that “supporting products” include components/parts/materials used in electrical/electronic equipment. The 2026 Conformity Assessment Catalogue is a separate layer for products actually listed in its 33 categories; do not assume a bare MCU independently needs catalogue conformity assessment merely because it is a component. Exact controlled technology/end-use may require additional strategic-control screening.	Part number, substance data, packaging/marking, traceability and end-use. Do not assume CCC solely from the word “IC”.	Datasheet, material/RoHS declaration, origin file, lot/date code, end-user/end-use data when triggered.
Hong Kong	Second-largest 8542 route; major re-export hub	High	Under Cap.60/60G, strategic commodities within the Schedules require import/export/re-export licences; TID offers pre-classification.	Do not equate “free port” with “no controls”. Exact technical capability, consignee, end-user and end-use matter.	Technical data, end-user statement where requested, pre-classification/licence if controlled, shipment traceability.
United States	Third major 8542 route	High	No Vietnam–US preferential FTA. A bare MCU should not be assigned a generic certification; however a Vietnam-made item may still be subject to the EAR through U.S.-content or FDP rules.	Country of origin, part/revision and U.S.-origin technology/content analysis where relevant; AEC-Q100/JEDEC are contractual/industry controls if required.	Origin records, fab/assembly/test flow, supplier ECCN/CCATS if available, end-use screening, commercial docs.
Netherlands / EU	Largest EU routing signal in WITS 8542 data	Medium-high	EVFTA may support preference if PSR is met. CE is only used where applicable EU legislation mandates it; do not affix CE merely because the item is a chip. RoHS/REACH evidence supports downstream EEE compliance.	Determine the legal role of a bare component versus finished EEE. Buyers may require RoHS/REACH, IMDS, PPAP or AEC-Q100 by sector.	Material declaration, RoHS/REACH statement, origin audit trail, technical/quality file, buyer specification.

MARKET-SELECTION CONCLUSION: China is dominant, but semiconductor supply chains are cross-border and Hong Kong/Netherlands may be logistics or re-export hubs. Because the brief gives no final buyer/destination, the H1 remains general and the article compares four routes.

WTO – Viet Nam HS 854231 WITS – Vietnam HS 8542 Hong Kong TID

4. VIETNAM EXPORT POLICY

Scenario	Possible control	Basis	Authority	Trigger
Standard commercial MCU	Foreign-trade/customs screening; do not infer a licence from the product name alone	Foreign Trade Management Law; Decree 69/2018 through 4 Sep 2026; Decree 292/2026 from 5 Sep 2026	Customs / specialized authority when triggered	HS, exact model, specification, condition, end-use
Secure/crypto/high-performance/sensitive end-use	Strategic-trade screening; permit/control may arise if the item meets a controlled-list entry	Decree 259/2025; Circular 42/2026/TT-BCT from 12 Sep 2026	MOIT / competent authority	Performance, encryption, radiation tolerance, end-user/end-use/destination
Sample / engineering sample / RMA	Review customs regime, value, ownership and purpose	Current customs/foreign-trade rules	Customs	Free/paid sample, warranty/repair, ownership
MCU on board/module or with battery	Reclassify the module; battery/DG screening if present	HS + transport rules for actual configuration	Customs / carrier	Board function, RF, battery chemistry

OLD → NEW: Decree 292/2026/ND-CP, issued 22 Jul 2026, takes effect 5 Sep 2026 and replaces Decree 69/2018. Circular 42/2026/TT-BCT, issued 29 Jul 2026, takes effect 12 Sep 2026 and was not yet effective on 28 Aug 2026. Because some ICs may be dual-use by technical parameters, a generic “electronic component” description is not a substitute for screening.

5. HS CODE – EXPORT DUTY – EXPORT VAT

5.1. REFERENCE HS

Variant	Reference HS	Classification basis	Evidence
MCU / processor-controller IC	8542.31.00	Processors/controllers, whether or not combined with memory, converters, logic, amplifiers, clocks/timers or other circuits	Datasheet, architecture, block diagram, package, part number
Memory IC	8542.32	Memory principal function	Type/capacity
Amplifier IC	8542.33	Amplification function	Datasheet
Other IC	8542.39	Other integrated circuit	Function/architecture
Die/wafer/unfinished stage	Review actual status	Completion stage/current nomenclature	Process flow, wafer/die status
Board/module/dev kit	Reclassify	Not necessarily a bare integrated circuit	BOM, schematic, interfaces, peripherals

8542.31.00 IS A REFERENCE, NOT A DEFAULT “MCU CODE”: classify the exact part. HS classification and strategic-trade classification are separate systems.

5.2. EXPORT DUTY

CONCLUSION: do not automatically write “0%”. Confirm the final 8-digit HS and check Annex I of Decree 26/2023/ND-CP together with effective amendments, including Decrees 108/2025 and 199/2025 where relevant.

LEGAL BASIS: Decree 26/2023/ND-CP, effective 15 Jul 2023; review Article 4, Annex I and amendments.

EXECUTION: retain a classification memo, datasheet, exact part and tariff check as of declaration date.

5.3. EXPORT VAT

CONCLUSION: qualifying exports may use 0% VAT only when the statutory scope and evidence conditions are met; it is not automatic.

LEGAL BASIS: Decree 181/2025/ND-CP, effective 1 Jul 2025; review Articles 17–18.

EXECUTION: reconcile Contract/PO, Invoice, payment evidence, customs declaration and shipment records.

6. C/O – FTA – RULES OF ORIGIN

Market	FTA/route	Origin proof	PSR/criterion	Other condition	Key origin evidence
China	RCEP / ACFTA	Route-specific proof/C/O	RCEP HS2012 8542.31 = CTSH or RVC40; check ACFTA against the correct annex/HS version	Map current HS to agreement nomenclature	Wafer fab, die source, assembly/test, process flow, costing/RVC, lot traceability
Hong Kong	AHKFTA	Form AHK/current mechanism	Check exact 8542.31 PSR in the current AHKFTA annex; do not borrow the RCEP rule	Clarify re-export/final-destination route	Origin Audit Trail + shipment/end-user mapping
United States	No bilateral preferential FTA	Non-preferential COO if requested	No bilateral FTA PSR for preference	Origin may depend on semiconductor production steps	Fab → assembly → test → packaging flow; transformation evidence when needed
Netherlands / EU	EVFTA	EUR.1 / current EVFTA origin mechanism	Circular 14/2026/TT-BCT: map exact HS to the applicable ex Chapter 85 PSR and annex before claiming	No preference without verified process/origin evidence	Wafer/die origin, process flow, assembly/test, supplier declarations, costing, lot records

SEMICONDUCTOR ORIGIN AUDIT TRAIL: design owner → wafer fab → wafer lot → die source → assembly/packaging → electrical/final test → OSAT records → supplier declarations → production batch → costing/RVC → part/revision → Invoice/C/O/AWB-BL mapping.

FTA GATE: a chip can be designed in country A, fabricated in B, assembled/tested in C and exported from Vietnam. “Made in Vietnam” in a commercial file does not by itself prove preferential origin; test the specific agreement rule.

FTA NOMENCLATURE: the RCEP PSR cited here is checked against HS 2012 8542.31, while the WITS market signal uses HS H0 8542 (HS 1988/92). Map the current 8-digit HS to each agreement’s HS version before applying a PSR or origin proof.

7. MICROCONTROLLER × MARKET SPECIALIZED COMPLIANCE

KEEP THREE LAYERS SEPARATE: Vietnam export controls, destination regulation, and buyer/industry specifications. AEC-Q100, JEDEC, PPAP, IMDS, MSL or supplier quality manuals are not automatically government law.

Trigger	Vietnam	China	Hong Kong	United States	Netherlands / EU
Standard MCU IC	HS + foreign-trade screen	Review China RoHS for EEE/supporting components; do not infer CCC from “IC”	If not within strategic schedules, do not apply licence logic; pre-classify when uncertain	Customs/origin; no single generic “US certificate” for bare MCUs	Determine component vs finished-EEE role; CE only if applicable legislation requires it
Crypto / secure MCU	Decree 259 + effective detailed list	Exact function/end-use control screen	Cap.60G classification/licence if capability is in scope	EAR encryption/ECCN analysis may arise when the item/technology is subject to the EAR	EU dual-use/end-use screen by exact specification
Advanced/high-performance/sensitive IC	Check exact thresholds, not generic clock speed	End-user/end-use matters	TID technical assessment/end-use data if controlled	EAR de minimis/FDP rules can capture foreign-produced items in defined cases	EU dual-use classification if the control list is met
Substance compliance	Buyer/commercial unless another export trigger applies	MIIT Order 32: official FAQ includes components/parts/materials as supporting products; MIIT Announcement 2026 No.11 replaced the 2018 catalogue with the 2026 catalogue of 33 product categories. Catalogue conformity assessment applies only where the exact supplied product is listed; do not automatically treat a bare MCU as a catalogue product.	Buyer/end-market dependent	Buyer/state/product dependent	RoHS/REACH evidence often supports downstream manufacturer compliance
Automotive / industrial grade	No permit solely because of grade	AEC-Q100, PPAP, IMDS, functional-safety evidence and traceability may be buyer/OEM requirements. Call them legal requirements only when a specific statutory trigger is verified.

U.S.-ORIGIN TECHNOLOGY: for a Vietnam-made chip containing controlled U.S.-origin content/technology/software or caught by a foreign-direct-product chain, determine whether the item is “subject to the EAR” before export-from-abroad/reexport. Do not infer EAR status merely because U.S. equipment was used.

8. EXPORT DOCUMENT SET & SUBMISSION CHANNEL

Group	Documents	Use	Owner	Channel	Data to reconcile	Common failure
Commercial	Contract/PO, Invoice, Packing List	Customs, booking, buyer/bank	Sales/Docs	Customs/carrier/buyer/bank	Part, revision, qty, value, Incoterm, origin	Generic “IC/Microcontroller”; part mismatch
Customs	Export declaration + classification file	Export clearance	Customs/Docs	Vietnam electronic customs/current channel	HS, description, part, origin, value, qty	IC confused with module/dev board
Compliance/strategic	Datasheet, security/RF statement, end-use/end-user, permit/classification if triggered	Pre-Cargo Ready	Compliance/Engineering/Sales	Competent authority / TID/BIS/importer route by market	Exact spec/revision/destination/end-user	Marketing datasheet lacks control parameters
Origin	C/O/proof + process flow + supplier declarations + costing	Preference/origin verification	Docs/Factory/Procurement/Finance	eCoSys/agreement mechanism	HS, criterion, fab/assembly/test facts, invoice, shipment	BOM kept without semiconductor process trail
Quality/buyer	COC, RoHS/REACH, tests, AEC-Q100/PPAP if contracted, lot/date-code list	Buyer acceptance	QA/Engineering	Buyer portal/email/QMS	Part/revision/lot/package/grade	Certificate family does not cover revision/grade
Transport	Booking, AWB/B/L, SI/VGM if sea, ESD/MSL packing records	Shipping/post-shipment	Forwarder/Docs/Warehouse	Carrier/terminal/air cargo	Packages, GW/NW, marks, lot, consignee	Dry pack opened; HIC/MSL record missing

9. LEGAL / REGULATORY MATRIX – THREE LAYERS

Layer	Source	Authority	Timing	Article/annex	Application	Transition/note
Vietnam – foreign trade	Decree 69/2018 → 292/2026/ND-CP	Government	5 Sep 2026	Clause 1 Article 65: effective date and replacement of Decree 69/2018; annex/list by exact goods	Export/import framework	28 Aug 2026 is still before Decree 292 takes effect
Vietnam – strategic trade	259/2025/ND-CP	Government	10 Oct 2025	Apply transaction/control-list provisions as relevant	Strategic trade	Exact item/end-use/end-user
Vietnam – dual-use list	42/2026/TT-BCT	MOIT	12 Sep 2026	Detailed MOIT dual-use list	Technical classification	Not yet effective on 28 Aug
Vietnam – export tariff	26/2023 + 108/2025 + 199/2025	Government	26: 15 Jul 2023	Art.4, Annex I + amendments	Export duty	Check final HS/date
Vietnam – VAT	181/2025	Government	1 Jul 2025	Arts 17–18	0% VAT and conditions	Not automatic
FTA – RCEP	Annex 3A PSR	RCEP Parties / MOIT	Vietnam from 1 Jan 2022	HS2012 8542.31: CTSH or RVC40	China origin route	Map HS version
FTA – EVFTA	Circular 14/2026/TT-BCT	MOIT	10 May 2026	Applicable ex-Chapter 85 PSR / exact annex	EU origin route	Check exact HS/process
Hong Kong	Import and Export Ordinance Cap.60 + Strategic Commodities Regulations Cap.60G	Trade and Industry Department	Current; schedules amended periodically	Section 6A framework; Schedules 1–4; TID licensing guidance	Controlled IC import/export/re-export	SC013 pre-classification; not every IC is controlled
China – RoHS	MIIT et al. Order No.32 + official FAQ + MIIT Announcement 2026 No.11 (2026 Conformity Assessment Catalogue)	MIIT + competent ministries	Order 32: 1 Jul 2016; 2026 Catalogue: 28 May 2026	Order 32 Arts.2–3, 11, 13, 17–18; FAQ Q10 on supporting products/components; Announcement 2026 No.11 replaced the 2018 catalogue	China RoHS general substance/marking scope + catalogue conformity assessment where the exact supplied product is listed	2026 Catalogue contains 33 product categories; do not automatically treat a bare MCU as a catalogue product
United States	EAR Parts 732, 734, 736	BIS	Current	§734.4 de minimis; §734.9 FDP; General Prohibitions	U.S.-content/FDP/reexport screen	Not a generic import certification
EU	Directive 2011/65/EU; REACH; CE framework	EU / Member States / ECHA	Current consolidated text	RoHS Art.3 definitions, Art.4 restrictions; REACH Art.33 where applicable	Downstream EEE compliance evidence	CE only where the supplied product is in scope

GATE

C/O conflicts with fab/assembly facts; buyer hold on lot/revision; origin/EAR verification lacks records.

11. PRE-ETD / CARGO READY / CUT-OFF TIMELINE

Milestone	What to lock	Records	Owner	Risk if late
Pre-contract	Scope, market, preliminary HS, strategic screen, FTA, buyer grade	Datasheet, end-use, buyer spec, supply-chain origin	Sales/Engineering/Compliance	Order accepted before part/market readiness
Pre-Cargo Ready	Control permit if triggered, COC/material/origin, ESD/MSL packing	Release, origin trail, compliance statements	QA/Compliance/Factory	Goods packed but not document-released
Pre-air acceptance / CFS	Customs, packages/GW, security, handover	Declaration, booking, packing data	Ops/Customs/Forwarder	Missed flight/roll/rebooking
Pre-AWB / SI-VGM cut-off	Consignee, marks, weight, licence reference	AWB draft or SI/VGM	Docs/Forwarder	Amendment/discrepancy
Post departure	Origin, final transport doc, lot/compliance set, payment	Final AWB/B/L, origin, quality/buyer docs	Docs/QA/Finance	Clearance/payment/origin-verification delay

Do not invent processing-day commitments. Semiconductor air shipments follow flight/cargo-terminal cut-offs; Sea follows actual carrier SI/VGM/CY/CFS milestones.

12. INCOTERMS – TRANSPORT – PACKING – COST

Shipment	Mode	Packing/handling	Control	Risk
Sample/engineering lot	Air/express	ESD bag/tray, secure box, lot label	Value, sample purpose, export-control status	Courier hold, wrong value/part
Production lot – high value	Air freight	JEDEC tray/tape-reel, MBB, desiccant/HIC per MSL, anti-static	Security, chain of custody, lot/GW, insurance	ESD/moisture/theft/loss
High volume / less urgent	Sea LCL/FCL where commercially justified	Moisture protection, pallet/carton, anti-static, ISPM15 if wood	CFS/CY, VGM, humidity/handling	Long exposure, moisture, LCL handling
Dev kit/board/battery	Air/Sea	Reclassify packing; battery DG screen	Board HS, RF, UN38.3/SDS if applicable	Bare-IC logic applied incorrectly

INCOTERMS – CHOOSE FOR THE CONTROL CHAIN

FCA: often suitable for Air/courier B2B when the handover point must be clear.
FOB/CFR/CIF: use only for appropriate Sea shipments; do not apply them mechanically to air freight.
CPT/CIP: useful for multimodal/air when seller books main carriage; CIP has a different insurance obligation from CPT.
DAP/DDP: confirm importer-of-record, strategic licensing, VAT/duty and market compliance before committing.

COST SCOPE: classification/compliance, origin, secure packing, ESD/MSL materials, trucking, air/sea freight, insurance, airport/terminal/local charges, rebooking/amendment/storage, third-party testing if buyer-required. Do not publish fixed charges without a verified quotation.

13. RISKS & CONTROL POINTS

Risk	Root cause	Impact	Control	When
MCU classified as module or vice versa	Generic trade name	Wrong HS/policy/origin	Technical classification file	Pre-contract/classification
Secure MCU not screened	Only HS8542.31 reviewed	Licence/compliance breach	Spec + end-use/end-user matrix	Pre-order/Cargo Ready
Hong Kong re-export of controlled item	“Free port” assumption	Hold/violation	TID pre-classification/licence screen	Pre-shipment
U.S.-origin tech/FDP overlooked	No EAR applicability analysis	Reexport restriction/buyer hold	Supplier ECCN + EAR memo	Pre-contract
EVFTA/RCEP origin fails	BOM without fab/assembly/test trail	Preference loss/origin verification	Semiconductor Origin Audit Trail	Pre-C/O
RoHS/REACH/China RoHS file weak	Insufficient supplier data	Buyer/market hold	Material declaration + revision mapping	Pre-Cargo Ready
ESD/MSL damage	Incorrect dry-pack/handling	Latent failure/claim	ESD + MBB/HIC/desiccant + MSL record	Packing/handover
Lot/date-code/revision mismatch	Weak warehouse master data	Buyer QA/payment hold	Lot-package-invoice-COC matrix	Packing/post-shipment
Missed flight/cut-off	Late customs/handover	Rebooking/delay	Mode-specific milestones	Pre-departure

14. FAQ

1. What HS is commonly referenced for a microcontroller?

For a complete processor/controller IC, 8542.31.00 is the main reference. Confirm the exact datasheet and physical status; a module/dev board is not automatically classified there.

2. Does a crypto-enabled MCU require a Vietnam export licence?

Not based on the word “encryption” alone. Compare exact functions/parameters, destination, end-user and end-use against Decree 259 and the detailed list effective at the transaction date.

3. Why China, Hong Kong, the US and the Netherlands/EU?

WTO confirms the large 854231 export base, while WITS 2023 for the broader 8542 IC family identifies these as the first four routes. Family data is a market signal, not MCU-only partner data.

4. Does every MCU exported to Hong Kong need a Strategic Commodities Licence?

No. Licensing applies when the item falls within Cap.60G Schedules by technical capability. TID offers pre-classification where status is uncertain.

5. Does a bare MCU entering the EU require a CE mark?

Do not affix CE simply because it is an electronic chip. CE is mandatory only when the supplied product is within EU legislation requiring CE; the component’s legal role must be determined correctly.

6. Should RoHS/REACH evidence be prepared for EU-bound MCUs?

Yes, especially because the chip becomes an input to downstream EEE and buyers need substance evidence. Use exact part/revision material declarations rather than calling them a “CE certificate”.

7. Can a chip made in Vietnam still be subject to the U.S. EAR?

Potentially, if it incorporates controlled U.S.-origin content above the applicable threshold or is captured by a foreign-direct-product rule. Review the actual supply chain.

8. What is the RCEP PSR for 8542.31?

The verified HS2012 rule is CTSH or RVC40. Map the current HS to the agreement nomenclature and verify origin process evidence before claiming.

9. Is AEC-Q100 a customs procedure?

No. It is a widely used automotive-IC qualification standard and is typically a buyer/OEM requirement when contractually specified.

10. What should be archived after shipment?

Classification, origin audit trail, fab/assembly/test records, strategic/EAR classification where relevant, COC/material declarations, lot/revision mapping, transport, buyer/bank/payment and claims records.

15. POST-SHIPMENT OUTPUTS & RECORDS

Completed export declaration and exact-part technical classification file.
Final AWB/B/L/Sea Waybill and carrier records.
C/O/origin proof and semiconductor Origin Audit Trail where preference is claimed.
Strategic-trade classification/permit/end-use file where triggered.
Fab–wafer–die–assembly–test–packaging traceability within the required origin scope.
COC, RoHS/REACH/China RoHS/material declarations and buyer qualification records where applicable.
ESD/MSL packing record and lot/date-code/revision/package mapping.
Buyer/bank/payment, debit/credit, claims/survey and corrective-action records.

TGIMEX IMPLEMENTATION SUPPORT

For Microcontrollers, the control chain should remain consistent across part number – technical classification – strategic status – origin process – lot/revision – packing – shipment, rather than relying on a generic product name and HS alone.

Exact-part HS and strategic-trade screening before shipment.
Market Access, end-use/end-user and buyer-compliance review by route.
FTA/origin, fab–assembly–test process and Origin Audit Trail review.
Invoice – PL – customs – C/O – COC – AWB/B/L – lot/revision reconciliation.
ESD/MSL packing, booking, customs, cut-off and post-shipment archive coordination.

ELECTRICAL – ELECTRONICS – IT EQUIPMENT

F&B

MACHINERY

HOUSEHOLD GOODS

COSMETICS – PERSONAL CARE

ELECTRICAL – ELECTRONICS – IT EQUIPMENT

F&B – FOOD & BEVERAGE

MACHINERY

HOUSEHOLD GOODS

COSMETICS – PERSONAL CARE

EXPORTING MICROCONTROLLERS FROM VIETNAM

1. QUICK FACTS

2. SCOPE & MICROCONTROLLER CLASSIFICATION

3. EXPORT MARKETS & MARKET ACCESS

3.1. MARKET SCAN – DATA FIRST

4. VIETNAM EXPORT POLICY

5. HS CODE – EXPORT DUTY – EXPORT VAT

5.1. REFERENCE HS

5.2. EXPORT DUTY

5.3. EXPORT VAT

6. C/O – FTA – RULES OF ORIGIN

7. MICROCONTROLLER × MARKET SPECIALIZED COMPLIANCE

8. EXPORT DOCUMENT SET & SUBMISSION CHANNEL

9. LEGAL / REGULATORY MATRIX – THREE LAYERS

10. E2E EXPORT WORKFLOW

PART NUMBER + MARKET SCAN

HS – STRATEGIC SCREEN – FTA

CONTRACT + BUYER QUALITY DATA

COMPLIANCE + ORIGIN + TRACEABILITY

ESD/MSL PACKING – BOOKING – HANDOVER

EXPORT DECLARATION

AWB / SI – VGM – CFS – LOADING

ORIGIN – BUYER/BANK SET – ARCHIVE

11. PRE-ETD / CARGO READY / CUT-OFF TIMELINE

12. INCOTERMS – TRANSPORT – PACKING – COST

INCOTERMS – CHOOSE FOR THE CONTROL CHAIN

13. RISKS & CONTROL POINTS

14. FAQ

1. What HS is commonly referenced for a microcontroller?

2. Does a crypto-enabled MCU require a Vietnam export licence?

3. Why China, Hong Kong, the US and the Netherlands/EU?

4. Does every MCU exported to Hong Kong need a Strategic Commodities Licence?

5. Does a bare MCU entering the EU require a CE mark?

6. Should RoHS/REACH evidence be prepared for EU-bound MCUs?

7. Can a chip made in Vietnam still be subject to the U.S. EAR?

8. What is the RCEP PSR for 8542.31?

9. Is AEC-Q100 a customs procedure?

10. What should be archived after shipment?

15. POST-SHIPMENT OUTPUTS & RECORDS

RELATED ARTICLES

HS classification principles

Export E2E workflow

Incoterms and local charges

TGIMEX IMPLEMENTATION SUPPORT

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