Tiếng Việt
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MEMORY IC EXPORT GUIDE FROM VIETNAM
Memory ICs are high-value semiconductor components, but the documentation risk lies in correct product identity, goods status, actual origin and the re-export route. Confusing a memory chip with a RAM module, SSD or controller IC can change the HS classification and origin logic.
This guide follows product scope → market → HS 8542.32.00 → origin/re-export → market controls → ESD/MSL packing → post-shipment; secure-memory/cryptography and strategically controlled models require separate conclusions.
1. QUICK FACTS
2025 shipment data records HS 85423200 Memory IC flows from Vietnam to China, South Korea, Hong Kong and the United States.
Ordinary Memory ICs do not automatically require an export licence; secure-memory, re-exported goods and items subject to foreign export controls require separate screening.
8542.32.00 is a strong reference for bare Memory ICs; RAM modules assembled on PCB fall under a different branch.
China: ACFTA/RCEP; Korea: VKFTA/RCEP; Hong Kong: AHKFTA; US: no bilateral Vietnam–US FTA.
Hong Kong has Strategic Commodities Control; US-origin/EAR-subject chips may require ECCN/end-user/end-use screening on re-export.
Lock P/N, capacity, package, origin, lot/date code and original import declaration for re-export before Cargo Ready.
Air is often practical; packing should control ESD, MSL, MBB, desiccant, HIC and reel/tray/tube.
2. PRODUCT SCOPE & MEMORY IC CLASSIFICATION
| Variant | Key checks | Evidence | HS/policy | Conclusion |
|---|---|---|---|---|
| Bare DRAM/SDRAM/DDR IC | Single IC; principal function is volatile memory | Datasheet, P/N, package, capacity | 8542.32.00 | Within scope. |
| NAND/NOR Flash IC | Non-volatile memory IC | Datasheet, architecture, capacity | 8542.32.00 is a strong candidate | Distinguish SSD/storage devices. |
| EEPROM / serial memory IC | I2C/SPI/serial memory | Datasheet, interface, density | 8542.32.00 | Secure functions require separate review. |
| eMMC/UFS IC package | Flash + controller inside semiconductor package | Full datasheet, block diagram | May remain 8542.32.00 if the principal nature is a memory IC | Do not classify by the word module alone. |
| RAM module / SO-DIMM / DIMM | Multiple ICs soldered on PCB | Module drawing/BOM | Vietnam Customs has referenced 8473.30.10 | Outside bare-IC scope. |
| SSD / memory card | Storage device with controller/PCB/connector | Product datasheet | May fall under 8523.51 or another heading | Separate article. |
| Controller / MCU with memory | Memory is secondary to processing/control | Block diagram | May fall under 8542.31/8542.39 | Separate from Memory IC. |
| Secure memory IC | Encryption/key storage/authentication | Security datasheet | Screen Decree 211/2025 where triple-match applies | Do not treat all Flash/EEPROM as civil cryptography. |
3. EXPORT MARKETS & MARKET ACCESS
| Market | Fit | Market Access | Product/company requirements | Documents/data |
|---|---|---|---|---|
| China | High – 2025 shipment evidence | A bare Memory IC is not automatically a CCC product; if subject to the EAR, screen ECCN/destination/end-user separately. | P/N, capacity, package, origin, ECCN where relevant. | Datasheet, origin file, ACFTA/RCEP origin document if PSR is met. |
| South Korea | High – multiple 2025 shipments | Do not automatically treat a bare IC as KC/RRA-regulated completed equipment. | P/N, package, voltage/temp; buyer may require JEDEC/AEC-Q100/PPAP. | Datasheet, CoC/QA, VKFTA/RCEP origin evidence if eligible. |
| Hong Kong | High – multiple memory/re-export flows | Strategic Commodities Control Category 3/3A001 may apply by technical parameters; controlled items need licences. | Temperature/radiation/architecture, origin/ECCN, end-use/end-user. | Technical classification/pre-classification and licence if controlled. |
| United States | Medium-high – 2025 shipment evidence | Ordinary Memory ICs do not have a blanket special import permit solely because they are ICs; origin marking under 19 CFR Part 134 must be reviewed. | Origin, P/N, value, lot/date code. | Commercial docs, COO marking evidence, factual origin memo. |
4. VIETNAM EXPORT CONDITIONS / POLICY
Standard Memory ICs generally follow ordinary electronics-export procedures, but Vietnam-manufactured goods, EPE/production goods, re-export/return goods and secure-memory must be separated.
For civil cryptography, apply Decree 211/2025/ND-CP: licensing requires the simultaneous match of HS code, goods description and cryptographic technical characteristics. Items subject to the EAR may retain re-export obligations based on origin/technology.
Lock customs regime, original import declaration, actual origin, P/N/datasheet and crypto/ECCN statement before confirming the route.
| Scenario | Policy | Trigger | Authority | Control gate |
|---|---|---|---|---|
| Vietnam-manufactured Memory IC | Ordinary export + HS/origin | Bare IC, no special trigger | Customs/C/O | Do not claim preferential origin before PSR is met. |
| Imported then re-exported/returned | Correct customs regime + original import link | Unchanged/limited processing | Customs | Do not mark Vietnam origin merely because shipper is in Vietnam. |
| Secure-memory/crypto | Screen Decree 211/2025 | Crypto + triple-match | Government Cipher Committee if triggered | Authentication-only is not automatically licensed cryptography. |
| US-origin/EAR-subject | ECCN/end-user/end-use screening | Item subject to EAR | Exporter compliance/BIS if applicable | HS does not replace ECCN. |
5. HS CODE – EXPORT DUTY – EXPORT VAT
| Product | Reference HS | Basis | Export duty | Export VAT | Evidence |
|---|---|---|---|---|---|
| Bare/packaged Memory IC | 8542.32.00 | Customs 2038 + integrated-memory nature | Check current tariff by final HS | 0% only if conditions are met | Datasheet/P-N/package/capacity |
| RAM module | 8473.30.10 reference | ICs assembled on PCB | By final HS | By actual case | Module BOM/PCB |
| SSD/storage device | May be 8523.51 or other | Complete storage device | By final HS | By actual case | Controller/interface/casing |
| Controller/logic IC | May be 8542.31/8542.39 | Principal function is not memory | By final HS | By actual case | Block diagram |
Do not mechanically state 0%. Lock final HS and check Decree 26/2023 and amendments, including Decree 201/2026 effective 23 Jul 2026.
Decree 181/2025 → 359/2025 → 144/2026, effective 20 Jun 2026; 0% applies only when statutory/documentary conditions are met.
6. C/O – FTA – RULES OF ORIGIN
| Route | FTA | Origin document | PSR/origin logic | Risk | Origin Audit Trail |
|---|---|---|---|---|---|
| Vietnam → China | ACFTA / RCEP | Form E / RCEP document | Check exact PSR for HS 8542.32 | Re-exported chips may retain original origin | Wafer/die/package origin, assembly/test process, import docs. |
| Vietnam → Korea | VKFTA / RCEP | Form VK / RCEP document | Check tariff + PSR + production evidence | Many flows are returns/re-exports | BOM, batch/lot, cost records, declaration refs. |
| Vietnam → Hong Kong | AHKFTA where applicable | AHKFTA origin document | Check exact PSR/direct consignment | Strategic licence is a separate layer | Origin + strategic classification file. |
| Vietnam → US | No bilateral FTA | Non-preferential origin | Substantial transformation/factual production | Do not mark Made in Vietnam if only repacked/tested insufficiently | Manufacturing/process memo + marking file. |
7. PRODUCT-SPECIFIC COMPLIANCE
| Trigger | Possible requirement | Basis/scope | When applicable | Avoid |
|---|---|---|---|---|
| Secure-memory/crypto | Vietnam civil-crypto screening | Decree 211/2025 triple-match | IC actually uses cryptography to protect data | Do not classify all EEPROM/Flash as civil-crypto products. |
| Hong Kong strategic IC | Import/export/re-export licence | Strategic Commodities Category3/3A001 | Chip meets controlled technical parameters | Do not decide by HS alone; technical classification is required. |
| US-origin/EAR-subject re-export | ECCN/end-user/end-use screening | US EAR | Item is subject to the EAR | HS does not replace ECCN. |
| Automotive memory | AEC-Q100/PPAP often buyer requirements | Industry/customer spec | Automotive buyer requires them | Not a blanket customs permit. |
| ESD/MSL | MBB/desiccant/HIC handling | JEDEC/buyer packing | Moisture-sensitive package | Do not ship with failed seal/HIC/MSL evidence. |
8. EXPORT DOCUMENT SET & FILING
| Group | Documents | Used at | Owner | Data to match | Common error |
|---|---|---|---|---|---|
| Commercial | Contract/PO, Invoice, PL | Customs/booking/buyer | Sales/Docs | P/N, qty, value, Incoterm, origin | Generic IC description; P/N missing. |
| Technical | Datasheet, package drawing, HS memo | HS/customs | Engineering/Customs | Memory function, package, capacity | Module/SSD confused with IC. |
| Re-export/origin | Original import declaration, RMA, BOM/process | Customs/C/O | Customs/Factory | Original origin, declaration ref | Vietnam origin claimed for unchanged re-export. |
| Compliance | Crypto/ECCN/strategic classification | Pre-Cargo Ready | Compliance/Legal | P/N, specs, destination/end-user | HK/China route not screened. |
| QA | CoC, lot/date code, test | Buyer acceptance | QA | P/N, lot, qty | CoC does not match packing. |
| Transport | Booking, AWB/B/L, packing evidence | Shipment | Forwarder/Docs | Carton/reel/tray, weight, marks | Missing ESD/MSL evidence. |
9. LEGAL / REGULATORY MATRIX
| Layer | Instrument/source | Authority | Effective | Article/scope | Application | Old → new |
|---|---|---|---|---|---|---|
| VN – classification | 2038/TCHQ-TXNK, 29 Apr 2021 | Vietnam Customs | Reference | RAM chip 8542.32; module 8473.30.10 | IC/module distinction | Check current nomenclature. |
| VN – civil cryptography | Decree 211/2025/ND-CP | Government | 9 Sep 2025 | Art 4(1), Annexes I/II | Secure-memory where triple-match applies | Replaced Decrees 58/2016, 53/2018, 32/2023. |
| VN – export tariff | Decree26/2023; 201/2026 | Government | 23 Jul 2026 | Export tariff | Check final HS | 201 amended certain lines. |
| VN – VAT | 181/2025;359/2025;144/2026 | Government | 20 Jun 2026 | Export VAT | Conditional 0% | 181→359→144. |
| Hong Kong | Strategic Commodities Regulations | TID | Current 2026 | Category3/3A001 | Controlled ICs need licences | 2025 amendments/current system. |
| US | 19 CFR Part 134 | CBP | Current | COO marking | Origin/marking | Fact-specific exceptions. |
| US re-export | EAR | BIS | Current 2026 | ECCN/end-user/destination | Only items subject to EAR | HS/C/O do not replace EAR. |
10. PRACTICAL E2E EXPORT PROCESS
PRODUCT SCOPE + MARKET
Determine bare Memory IC vs RAM module/SSD; lock type, P/N, capacity, package, origin and market.
LOCK HS – ORIGIN – EXPORT CONTROL
Use 8542.32.00 where the item is truly a memory IC; separate module/storage products; screen crypto/ECCN/strategic control if triggered.
CONTRACT + BUYER SPECS
Lock P/N, manufacturer, capacity, speed grade, package, temperature grade, lot/date code, Incoterm and payment.
COMPLIANCE + QA + ORIGIN FILE
Complete origin basis, RMA/re-export trail, Hong Kong strategic screening and ECCN/end-user screening where relevant; verify CoC/MSL.
BOOKING – ESD/MSL PACKING
Prefer air for high-value/low-weight lots; lock reel/tray/tube, MBB, desiccant, HIC, vacuum seal and insurance.
EXPORT CUSTOMS DECLARATION
Describe integrated electronic circuit – memory, P/N, capacity/type, new/return status, origin and original declaration for re-exports.
AWB/B/L – CUT-OFF – HANDOVER
Cross-check shipper/consignee, carton/reel quantity, weight, marks and C/O data; use the correct air/sea cut-off.
FINAL DOCS – PAYMENT – TRACEABILITY
Retain origin, import/re-export trail, lot/date code, CoC, QA, ECCN/strategic screening and claim file.
11. PRE-ETD / CARGO READY / CUT-OFF TIMELINE
| Milestone | What to lock | Documents/data | Owner | Delay risk |
|---|---|---|---|---|
| Before Contract | Product scope, origin, market, preliminary HS, ECCN/strategic screening | Datasheet, buyer spec, origin input | Sales/Compliance | Route not feasible. |
| Before production/return | P/N, lot/date, production vs re-export | PO/RMA/import declaration ref | Factory/QA/Customs | Missing re-export trail. |
| Before Cargo Ready | Origin basis, CoC, screening, MSL | Origin file, CoC, screening memo | Compliance/QA | Goods ready but compliance incomplete. |
| Before booking | Air/Sea, insurance, ESD/MSL pack | Booking, dimensions, GW/NW | Ops/Forwarder | Repack/missed flight. |
| Before handover | Customs + final packing | Declaration, booking, packing evidence | Customs/Ops | Hold due to origin/description. |
| Before AWB/B/L release | Consignee, P/N, package, weight, origin | AWB/B/L draft, Invoice/PL/C/O | Docs | Amendment/discrepancy. |
| Post-shipment | Buyer docs, payment, origin/lot archive | Final docs, CoC, lot trail | Docs/Finance/QA | Audit/payment delay. |
12. INCOTERMS – TRANSPORT – PACKING – COST
| Item | Approach | Data to lock | Risk/cost |
|---|---|---|---|
| Air | Preferred for high-value/light chips | Chargeable weight, cut-off, insurance | Missed flight/high-value handling. |
| Sea | For larger volume/consolidation | CBM, CFS/CY, humidity | Moisture/CFS handling. |
| ESD | Anti-static tray/tube/reel + ESD handling | Packing standard | Latent electrical damage. |
| MSL | MBB + desiccant + HIC + vacuum seal | MSL, seal date, HIC, bake record | Popcorn/cracking during SMT. |
| Traceability label | P/N, manufacturer, lot/date, qty, COO | Label master, carton/reel mapping | Wrong lot/COO → quarantine. |
| Incoterms | FCA/CPT/CIP for Air; FOB/CIF for Sea as appropriate | Named place, risk, insurance | Do not confuse risk and cost transfer. |
13. RISKS & CONTROL POINTS
| Risk | Root cause | Impact | Control | When |
|---|---|---|---|---|
| Wrong HS | Chip/module/device confusion | Customs/C/O error | Datasheet + physical construction | Pre-contract |
| Wrong Vietnam origin | Re-exported item labelled VN origin | C/O/marking error | Import trail + transformation review | Before C/O |
| HK strategic control missed | 3A001 parameters not screened | Hold/licence issue | Technical classification | Pre-contract |
| EAR re-export missed | Item subject to EAR not screened | Licence/end-user issue | ECCN/end-user screening | Before order |
| P/N/lot mismatch | Docs/reel/carton differ | Buyer quarantine | Master-data validation | Before packing |
| MSL/ESD failure | Incorrect handling/seal | Latent failure | MBB/HIC/ESD audit | Before shipment |
| FTA PSR failure | Vietnam process insufficient | Preference lost | Origin Audit Trail | Before C/O |
| RMA trail missing | Original import ref not retained | Customs/origin difficulty | Link import→RMA→export | Before customs |
14. FAQ
1. Can Memory IC use HS 8542.32.00?
Yes where the item is truly an integrated circuit whose principal function is memory; confirm with datasheet and construction.
2. Does a RAM stick use 8542.32.00?
Not normally. Vietnam Customs 2038 distinguishes RAM modules on PCB under 8473.30.10.
3. Is an SSD a Memory IC?
No. An SSD is a complete storage device and requires a different heading review.
4. Does export to Hong Kong require a licence?
Only if the chip falls within the Strategic Commodities schedules; technical classification is required.
5. Does a bare chip exported to China automatically need CCC?
No. Check the current CCC catalogue and actual imported form/end product.
6. Does a bare Memory IC automatically need KC/RRA in Korea?
No. The exact regulated end-product scope must still be checked.
7. Can re-exported goods obtain Vietnam preferential origin?
Only if the processing in Vietnam actually meets the applicable PSR; shipping from Vietnam is not the same as Vietnam origin.
8. What if a US-origin chip is re-exported from Vietnam to China?
If the item is subject to the EAR, screen ECCN, destination, end-user and end-use.
9. Does authentication automatically make a Memory IC a civil-cryptography product?
No. Apply Decree 211 triple-match and the actual cryptographic function.
10. What packing controls matter?
ESD, MSL, MBB, desiccant, HIC, seal date, reel/tray/tube and P/N/lot/date-code mapping.
15. POST-SHIPMENT OUTPUT & RECORD RETENTION
- Export declaration plus original import declaration/reference for re-export.
- Final Invoice/PL/AWB/B/L/C/O.
- Classification file: datasheet, P/N, package, capacity and IC-vs-module conclusion.
- Origin Audit Trail: wafer/die/package/assembly-test and BOM/value-add if Vietnam origin is claimed.
- ECCN/strategic/crypto screening record where triggered.
- CoC, lot/date mapping, QA and ESD/MSL packing records.
KEY SOURCES
GIẢI PHÁP TỪ TGIMEX
For Memory IC, lock bare IC vs module – HS – origin/re-export – market control – C/O – lot traceability – ESD/MSL packing before Cargo Ready.
NEED TO REVIEW IMPORT PROCEDURES OR A SHIPPING PLAN?
Send us the product name, shipping route, current dossier, or implementation request in advance so we can suggest a suitable approach that is practical, focused, and aligned with your shipment.
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