“Power module” is a high-risk commercial name for classification: the same label may describe an IGBT/MOSFET module, thyristor module, diode/rectifier module, Intelligent Power Module (IPM) or even an AC-DC/DC-DC static-converter module. If the product scope is wrong, HS, origin, strategic-trade screening and destination compliance can all be wrong.

This guide prioritizes semiconductor power modules within the board/semiconductor component family and separates variants that require another route. Market research uses representative semiconductor-device subheadings to select China – Hong Kong – Korea, then links Market Access to HS, origin, compliance, Cargo Ready, cut-offs and post-shipment records.

Market data uses WITS/UN Comtrade 2023 under H0 854129/854130/854110 (HS 1988/92) as route signals for transistor/thyristor/diode families. These are not “pure Power module” trade values and do not replace current 8-digit HS classification of the exact model. Not an official legal translation.

1. QUICK FACTS

MARKETS

China · Hong Kong · Korea

China/Hong Kong appear across transistor, thyristor and diode routes; Korea is particularly relevant to the diode/power-device route. This is a representative-family shortlist, not a universal top-three ranking for every Power-module model.

VIETNAM POLICY

Ordinary civil/industrial power modules are not automatically dual-use. Screen exact technology, Si/SiC/GaN materials, performance and end-use/end-user against Decree 259/2025 and the detailed list once Circular 42/2026 becomes effective.

HS – DUTY – VAT

8541.29 / 8541.30 / 8541.10

IGBT/MOSFET transistor modules, thyristor modules and diode/rectifier modules may fall in different branches. A “power module” that is actually a complete static converter must be reviewed under 8504.40.

ORIGIN / FTA

China/Korea: RCEP; Korea may also compare AKFTA. Hong Kong: AHKFTA/Form AHK. RCEP HS2012 8541.10/8541.29/8541.30 uses CTSH or RVC40; map the current HS to the agreement nomenclature first.

SPECIALIZED

China RoHS applies by scope but a bare power module is not automatically one of the 33 catalogue products. Hong Kong: strategic pre-classification if specifications are sensitive. Korea: separate a bare semiconductor module from a complete power supply in KC/Safety scope.

ETD / CUT-OFF

Lock topology + die technology + voltage/current + package + isolation + driver/protection + end-use before Cargo Ready. SI/VGM/CY/CFS follows the actual booking; no invented SLA.

TRANSPORT

Control ESD, moisture, shock and bent terminals; manage MSL where applicable. Semiconductor power modules are normally non-DG unless a battery, chemical or other DG trigger is actually present.

QUICK GLOSSARY: Power module = packaged power-semiconductor module; IGBT = insulated-gate bipolar transistor; MOSFET = metal-oxide-semiconductor field-effect transistor; IPM = Intelligent Power Module integrating power switches with driver/protection/control; SiC/GaN = wide-bandgap semiconductor materials; MSL = Moisture Sensitivity Level; ESD = electrostatic discharge; Market Access = destination-entry requirements; PSR = Product Specific Rule; CTSH = change in tariff subheading; RVC = Regional Value Content; Cargo Ready Date = goods-ready date.

2. SCOPE & POWER-MODULE CLASSIFICATION

Main scope: complete packaged semiconductor power modules used to switch, rectify or control power in inverters, motor drives, EV/charging systems, renewable energy, UPS, industrial automation or power-conversion equipment. Never use the commercial name “Power module” alone to determine HS.

Variant	What to check	Technical evidence	Possible HS/policy	Operational conclusion
IGBT / power MOSFET module	Transistor dies, half-bridge/6-pack topology, switching terminals/function	Datasheet, internal circuit, die type, topology, V/I rating, package drawing	Reference 8541.29.00 where the essential character is “other transistor”; strategic screen if technology/end-use intersects a control entry	Main scope.
Thyristor / SCR / triac module	Thyristor/diac/triac dies and controlled rectification	Circuit, semiconductor type, gate/current/voltage data	Reference 8541.30.00	Separate from transistor modules.
Power diode / rectifier module	Diode dies and rectification function	Internal circuit, VRRM/IF ratings, package	Reference 8541.10.00	Separate from IGBT/SCR.
Intelligent Power Module – IPM	Power switches plus gate driver and protection/control ICs in one module	Block diagram, BOM architecture, die/function split, package schematic	Separate classification review; do not automatically use 8541.29 or 8542	Lock principal function and architecture.
Static-converter power module	Complete AC-DC, DC-DC, inverter or rectifier conversion	Input/output, conversion topology, magnetics, PCB/BOM	May fall in 8504.40 family	Separate from semiconductor-device module.
Power-control board/module	PCB + relays/contactors/control and distribution	Schematic, wiring, enclosure, rated voltage, control function	May fall in 8537 or another heading depending configuration	Do not use 8541 merely because power semiconductors are present.
Battery power module	Cells/battery pack/BMS are the core function	Cell chemistry, capacity, BMS, UN38.3	8507/DG route as applicable	Outside semiconductor-module conclusion.
Bare die / substrate / parts	Not a finished module: die, DBC/AMB substrate, baseplate or intermediate item	BOM, process stage, material/wafer/die status	Different classification; strategic control may be sensitive for certain SiC/GaN substrates	Do not use finished-module HS.

TECHNICAL DESCRIPTION CHECKLIST: semiconductor type → Si/SiC/GaN → topology → rated voltage/current → switching/rectifying function → integrated driver/protection/control → isolation/baseplate → package/module status → battery/wireless/encryption if any → application/end-use → new/used/sample/RMA.

3. EXPORT MARKETS & MARKET ACCESS

3.1. REPRESENTATIVE-FAMILY MARKET SCAN

Because “Power module” has no single HS code, market research must use families consistent with the architecture. WITS/UN Comtrade 2023 reports Vietnam exports under 854130 at about US$351.56K, mainly China US$259.94K and Hong Kong US$79.92K. Under 854110, Vietnam exported about US$4.331m, including Korea US$1.430m, Hong Kong US$1.286m and China US$0.889m. These are H0/HS 1988/92 route signals, not exact Power-module values.

Market	Fit	Market-access condition	Product/business requirement	Documents/data to prepare
China	High	Customs/HS plus China RoHS by actual scope; strategic/import-control review if the exact technology is controlled. Do not assume CCC or China-RoHS catalogue conformity assessment for a bare module unless the supplied product is actually in the catalogue.	Lock part number, semiconductor technology, material declaration, rated V/I, die/package architecture and end-use. Automotive/industrial customers may request AEC-Q101, AQG 324 or PPAP as buyer/industry requirements, not universal law.	Datasheet, BOM/material declaration, RoHS records, CoC/tests, lot traceability, model/marking and end-use/end-user data where strategic screening applies.
Hong Kong, China	High	Hong Kong is a semiconductor trading hub. If the module falls within a Schedule to Cap.60G, import/export requires a licence. TID Pre-Classification can formally determine strategic/non-strategic status before shipment.	Brand/model/spec must match pre-classification/licence where applicable; trading buyers commonly require traceability, origin, manufacturer part number and anti-counterfeit controls.	Datasheet, technical questionnaire, brand/model, end-use/end-user, PCRN/pre-classification result and licence if the exact item is strategic.
Korea	Medium-high	There is an actual diode/power-device route. Do not assume a bare semiconductor module requires KC. A current 2026 Safety Korea certification record classifies 컴퓨터용 전원공급장치 (computer power supply) as an electrical appliance subject to Safety Confirmation, so component modules must be distinguished from complete PSU/static-converter products.	Lock component versus complete appliance status. Bare modules usually face buyer/OEM quality and reliability requirements; if the item is a complete PSU/inverter, re-check the statutory safety/KC scope.	Datasheet, circuit/function description, reliability/quality test, CoC, lot/date code and origin records; KC/safety records only when the exact product category requires them.

MARKET CONCLUSION: China and Hong Kong show trade signals across several semiconductor-device families; Korea is significant in the diode/power-device supply chain. Because “Power module” spans multiple architectures, keep the H1 generic and split deeper routes once a model is known: IGBT/IPM × China, Power module × Hong Kong strategic classification, and Power module × Korea OEM/KC trigger.

4. VIETNAM EXPORT POLICY

Scenario	Possible policy	Basis to check	Authority/channel	Trigger
Standard semiconductor power module	Ordinary commercial export; check current prohibited/restricted/licensed lists	Foreign Trade Management Law; Decree 69/2018 through 4 Sep 2026; Decree 292/2026 from 5 Sep 2026	Customs / specialized authority where triggered	HS, technology, condition, end-use/end-user
High-performance / strategic technology	Strategic-trade screening and licence where an exact control entry applies	Decree 259/2025; Circular 42/2026 from 12 Sep 2026	Competent ministry / MOIT according to control list	Technical parameter/material/end-use matches a controlled entry
SiC/GaN substrate / precursor / bare material	Do not copy the finished-module conclusion; review the strategic list separately	Decree 259/2025 + detailed lists by authority	Specialized authority	Material form, resistivity, structure, performance
Used/RMA/sample/warranty	Review customs regime, ownership, value, condition and purpose	Current customs/foreign-trade rules	Customs	Not a normal sale shipment
Power module with battery	Separate DG transport screening	IATA/IMDG/carrier rules by actual battery	Carrier/Forwarder	Lithium cell/battery shipped with or in equipment

IMMINENT TRANSITION: on the article date 3 Sep 2026, Decree 292/2026 is not yet effective. Clause 1 Article 65 makes it effective on 5 Sep 2026 and replaces Decree 69/2018. Circular 42/2026/TT-BCT becomes effective on 12 Sep 2026; before then it must not be described as already effective.

5. HS CODE – EXPORT DUTY – EXPORT VAT

5.1. REFERENCE HS MATRIX BY MODULE ARCHITECTURE

Variant	Reference HS	Classification basis	Key question	Evidence
IGBT/MOSFET transistor module	8541.29.00	Transistors, other than photosensitive – other	Is the essential character still a transistor device?	Internal circuit, die type, topology, V/I, package
Thyristor/SCR/triac module	8541.30.00	Thyristors, diacs and triacs	Gate-controlled semiconductor type	Datasheet/circuit
Power diode/rectifier module	8541.10.00	Diodes other than photosensitive/LED	Diode module versus complete static converter	Internal circuit/ratings
IPM	Separate review	Power switches + driver/protection/control integration	Architecture and principal function	Block diagram/BOM
AC-DC/DC-DC/inverter power module	8504.40 family	Static converters	Complete static power-conversion function	Input/output, conversion architecture
Control/distribution module	Review 8537/other heading	Electrical control/distribution as core function	Voltage, switches/controls, enclosure, wiring	Schematic/drawing/catalogue

DO NOT CLASSIFY BY “POWER MODULE”: changing transistor/thyristor/diode architecture, adding integrated driver/control, or moving from a semiconductor device to a complete static converter can change the HS logic.

5.2. EXPORT DUTY

CONCLUSION: do not mechanically state 0%. After confirming the final 8-digit HS, check Annex I – Export Tariff under Decree 26/2023/ND-CP and amendments effective on the declaration date.

LEGAL BASIS: Decree 26/2023/ND-CP, effective 15 Jul 2023; review Article 4 and Annex I.

EXECUTION: keep a technical classification file with catalogue, datasheet, schematic/block diagram, model/BOM status and the tariff check.

5.3. EXPORT VAT

CONCLUSION: 0% VAT is conditional; it is not automatic merely because goods leave Vietnam.

LEGAL BASIS: Decree 181/2025/ND-CP, effective 1 Jul 2025; Article 17 provides the 0% rate and Article 18 the applicable conditions.

EXECUTION: review Contract/PO, Invoice, qualifying payment evidence, customs declaration and shipment records.

6. C/O – FTA – RULES OF ORIGIN

Market/route	FTA to review	Origin proof	PSR/criteria	Evidence
China	RCEP / ACFTA	Route-specific proof/C/O	RCEP HS2012 8541.10 / 8541.29 / 8541.30 = CTSH or RVC40; review ACFTA separately under its nomenclature	BOM, die/substrate/package origin, supplier declarations, assembly/test records, RVC data if used
Hong Kong, China	AHKFTA	Form AHK/applicable mechanism	Check Annex 3-2 PSR against the correct HS/version before claiming; do not transplant the RCEP rule	Origin BOM, supplier records, production/assembly/test records and invoice-shipment mapping
Korea	RCEP / AKFTA	Route-specific proof/C/O	RCEP: CTSH or RVC40. AKFTA: 8541.10 / 8541.29 / 8541.30 = LVC40% or CTSH under Annex 2 PSR; this Annex uses the HS 2007 nomenclature	BOM, origin of dies/substrates/baseplates/package, cost data and production lot records

POWER-MODULE ORIGIN AUDIT TRAIL: supplier qualification → BOM → HS/origin of die, substrate, baseplate/ceramic, leadframe and driver IC → purchase/import records → assembly/bonding/soldering/sintering process → test/QA → production batch → costing/RVC → finished model/lot → Invoice/C/O/shipment.

FTA NOMENCLATURE: WITS market data above is H0, while RCEP/AKFTA PSRs use the nomenclature of each agreement. Map the current HS to the agreement HS version before applying a PSR. “Having a C/O” does not by itself guarantee preferential treatment.

7. POWER MODULE × MARKET SPECIALIZED COMPLIANCE

SEPARATE TWO LAYERS: Vietnam-side export controls versus destination compliance. AEC-Q101, AQG 324, PPAP, JEDEC, UL recognition or OEM reliability specifications are buyer/industry requirements unless a binding legal/tender requirement has been verified for the exact product.

Trigger	Vietnam side	China	Hong Kong	Korea
Standard semiconductor module	HS/policy screen; no generic export permit solely because it is a power module	China RoHS by scope; separate buyer/OEM quality layer	Customs + strategic-commodity screening by exact specification	Component route; do not assume KC for a bare module
SiC/GaN / high performance	Strategic-trade screen by exact parameters/material/end-use	Review technology/end-use/import controls if a control entry applies	Cap.60G Schedule 1; use TID pre-classification when uncertain	Review strategic/end-use requirements; buyer traceability may be deeper
Complete static converter / PSU	Reclassify under 8504.40 and screen exact equipment	Review China RoHS/catalogue/CCC only where the finished product is in scope	Review strategic/electrical requirements by complete equipment	Safety/KC scope may arise; Safety Korea currently classifies computer power supply under Safety Confirmation; check the exact product category
Automotive power module	No Vietnam permit solely because of automotive use absent another trigger	AEC-Q101/AQG324/PPAP are generally OEM/buyer requirements	Buyer traceability / anti-counterfeit controls	OEM qualification/reliability separate from market-wide law
Battery integrated	Separate DG screening	Transport + product rules by battery	Carrier/DG + strategic where applicable	Battery safety/transport route if a battery is actually included

7.1. CHINA RoHS – COMPONENT SCOPE IS NOT THE SAME AS CATALOGUE CONFORMITY

MIIT Order No.32 and its official FAQ can cover “supporting products”, including components/parts/materials used in electrical/electronic equipment. However, MIIT Announcement 2026 No.11 introduced the 2026 Catalogue with 33 product categories; the conformity-assessment layer applies according to the exact catalogue category and its implementation date. MIIT’s 2 Sep 2026 update states that the 10 legacy categories continue under conformity assessment, while the 23 newly added categories formally enter the conformity-assessment system on 1 Aug 2027. Do not state that every bare power module independently requires catalogue conformity assessment merely because it is an electronic component.

7.2. HONG KONG – STRATEGIC PRE-CLASSIFICATION BEFORE BOOKING

TID states that goods listed in the Schedules to Cap.60G require a valid import/export licence. Its Pre-Classification Service gives formal advice on whether a product is strategic even before a specific order or shipment exists, making it a useful gate for high-spec semiconductor modules with sensitive technical parameters.

MIIT – China RoHS Catalogue 2026
Hong Kong TID – Circular 11/2024
Safety Korea – Computer Power Supply

7.3. KOREA – COMPONENT VERSUS COMPLETE POWER SUPPLY

A current 2026 Safety Korea certification record identifies 컴퓨터용 전원공급장치 (computer power supply) as an electrical appliance subject to Safety Confirmation. This supports screening complete PSU products under Korea’s electrical-safety framework, but does not justify extending KC requirements automatically to a bare IGBT/IPM semiconductor module. If the supplied item is actually a complete power-supply/static-converter product, re-check the exact statutory category and applicable standard.

8. EXPORT DOCUMENT SET & SUBMISSION CHANNEL

Group	Documents	Used for	Owner	Submission/handling channel	Data to reconcile	Common failure
Commercial	Contract/PO, Invoice, Packing List	Customs, booking, buyer/bank	Sales/Docs	Customs/carrier/buyer	Part number, description, qty, value, Incoterm	Generic “Power module”; technology/topology missing
Customs	Export declaration + technical classification file	Export clearance	Customs/Docs/Engineering	Vietnam electronic customs	HS, description, model, origin, qty/value	8541 confused with 8504.40; old-model HS copied
Compliance/strategic	Datasheet, end-use/end-user, China RoHS, HK pre-classification/licence where triggered, Korea safety file for complete equipment	Pre-Cargo Ready / Market Access	Compliance/QA/Buyer/Importer	Destination authority/system; TID TSW/E-Account/paper route where applicable	Exact model, V/I, material, function, end-use	Certificate/classification does not cover the exact variant
Origin	C/O/proof + BOM + supplier origin records	Preference/origin verification	Docs/Factory/Procurement	eCoSys/agreement-specific origin mechanism	HS/version, criterion, invoice, shipment	C/O selected before PSR test
Transport/buyer	Booking, SI, VGM, B/L/AWB, CoC, lot/date-code list, reliability/tests	Shipping/post-shipment	Forwarder/Docs/QA/Finance	Carrier/terminal/buyer/bank	Packages, GW/NW, marks, lot/model	Lot/PO/Invoice/B/L mismatch; missed cut-off

MASTER DATA: manufacturer → part number → semiconductor type → Si/SiC/GaN → topology → rated voltage/current → switching frequency/dissipation → integrated driver/protection → package/baseplate/isolation → revision → lot/date code → end-use/end-user → origin → HS → FTA criterion.

9. LEGAL / REGULATORY MATRIX – THREE LAYERS

Layer	Source	Authority	Effective timing	Article/annex	Application	Transition/note
Vietnam – foreign trade	Decree 69/2018 → 292/2026/ND-CP	Government	5 Sep 2026	Clause 1 Article 65	Export/import framework	69 applies through 4 Sep; 292 replaces it from 5 Sep
Vietnam – strategic trade	Decree 259/2025/ND-CP	Government	10 Oct 2025	Arts.1–2 scope/application; detailed control entries by list	Strategic-goods exports	Do not assume every power module is dual-use
Vietnam – detailed dual-use list	Circular 42/2026/TT-BCT	MOIT	12 Sep 2026	Art.1 + Annex; Art.2 effective date	MOIT dual-use detailed list	Not yet effective on 3 Sep 2026
Vietnam – export tariff	Decree 26/2023/ND-CP	Government	15 Jul 2023	Article 4; Annex I	Export duty by final HS	No automatic 0%
Vietnam – VAT	Decree 181/2025/ND-CP	Government	1 Jul 2025	Arts.17–18	0% rate and conditions	Conditional
FTA – RCEP	RCEP Annex 3A	RCEP Parties / MOIT	Vietnam from 1 Jan 2022	HS2012 8541.10/8541.29/8541.30: CTSH or RVC40	China/Korea origin	Map nomenclature first
FTA – AKFTA	Annex 2 PSR	ASEAN–Korea	Under current agreement	8541.10/8541.29/8541.30: LVC40% or CTSH (Annex 2, HS 2007)	Korea origin route	Compare RCEP
FTA – AHKFTA	Chapter 3 / Annex 3-2 + origin procedure	ASEAN–Hong Kong	Current	Exact PSR by HS/version; Form AHK route	Hong Kong origin	Do not borrow the RCEP rule
China – RoHS	MIIT Order No.32 + MIIT Announcement 2026 No.11	MIIT + competent ministries	Order32: 1 Jul 2016; Catalogue2026 published/effective 28 May 2026; 23 new categories: conformity assessment from 1 Aug 2027	Order32 scope/marking; Catalogue2026 has 33 categories	Restricted substances + conformity layer by exact catalogue category and timing	2026 Catalogue replaced 2018 catalogue; do not assume immediate conformity assessment for every component
Hong Kong	Import and Export Ordinance Cap.60 + Strategic Commodities Regulations Cap.60G	Trade and Industry Department	Current	Schedules 1–4; Pre-Classification Circular 11/2024	Strategic-commodity licence/pre-classification	No blanket strategic classification
Korea	Electrical Appliances and Consumer Products Safety Control framework + Safety Korea certification database (current 2026 record)	KATS / Safety Korea	Current 2026	Current Safety Korea record classifies computer power supply as an electrical appliance subject to Safety Confirmation	Where the supplied item is a regulated complete electrical product	Do not assume bare semiconductor components require KC

C/O verification failure; buyer rejects lot/date-code; missing TID/licence record; ESD/moisture claim without packing evidence.

11. PRE-ETD / CARGO READY / CUT-OFF TIMELINE

Milestone	What to lock	Records	Owner	Risk if late
Pre-contract	Product scope, preliminary HS, Market Access, strategic screen, FTA, buyer qualification	Datasheet/block diagram, buyer spec, end-use, origin input	Sales/Engineering/Compliance/Procurement	Order accepted under wrong HS/compliance/market route
Pre-Cargo Ready	Final HS, compliance, HK classification/licence if any, China RoHS file, packing and origin evidence	Technical file, CoC/material declaration, lot plan, certificate/licence	QA/Compliance/Factory/Docs	Finished goods missing market/strategic file
Pre-CY/CFS	Customs, trucking, package/GW, ESD/moisture packing	Declaration, booking, packing data	Ops/Customs/Forwarder	Roll/rebooking/damage
Pre-SI/VGM	Shipper/consignee, marks, packages, weight, description	SI, VGM	Docs/Forwarder	B/L amendment/discrepancy
Post on-board	C/O, Final B/L/AWB, compliance/lot/buyer set, payment	On-board data, origin records, final buyer docs	Docs/QA/Finance	Preference/payment/claim-response delay

Do not invent fixed processing days. Pre-classification and buyer qualification may take time, but knowledge content should not promise an SLA without an official procedure or verified operating data.

12. INCOTERMS – TRANSPORT – PACKING – COST

Shipment profile	Mode	Packing	Control point	Risk
Sample/engineering lot	Air/express	ESD bag/tray, moisture barrier for MSL, desiccant/HIC	Declared value, lot/date-code, exact model	Courier handling, moisture/ESD
Mass-production semiconductor module	Air or Sea LCL/FCL by volume	Tray/reel/carton/pallet, shock/moisture protection, terminal protection	Lot segregation, GW/NW, labels	Mixed lot, bent terminal, corrosion/delamination
Heavy baseplate / industrial module	Air/Sea	Foam/custom tray, rigid carton/crate, lashing	Weight distribution, impact protection	Mechanical damage
Power module with lithium battery	Air/Sea by battery	DG pack/mark when triggered	UN38.3/SDS/battery spec/carrier acceptance	Booking rejection/repack

INCOTERMS – RISK ≠ COST

FCA/FOB: define delivery point, export customs, booking owner and origin local charges.
CPT/CIP/CFR/CIF: seller payment for carriage/insurance is not the same as the point of risk transfer.
DAP/DDP: review importer role, strategic licence/market compliance and ability to complete destination formalities.

COST SCOPE: reliability testing, strategic pre-classification/licence, China RoHS/material records, origin/C/O, ESD/MSL packing, trucking, local charges, freight, insurance, rebooking/amendment/storage and claim/survey. Do not publish fixed local charges without a verified quotation.

13. RISKS & CONTROL POINTS

Risk	Root cause	Impact	Control	When
Semiconductor module confused with static converter	Commercial name only	Wrong HS/origin/policy	Architecture + principal-function review	Pre-contract
IGBT/SCR/diode share one HS	Semiconductor type not separated	Classification error	Die/topology matrix	Classification
Hong Kong strategic status unresolved	High-spec part not pre-classified	Licence/carrier hold	TID pre-classification	Before Cargo Ready
China RoHS overclaim or missing material data	Supporting component confused with catalogue product	Buyer hold/rework	Scope + catalogue check + declaration	Before shipment
Korea KC applied to wrong scope	Bare module not separated from complete power supply	Over/under-certification	Component-vs-equipment decision	Pre-contract
Strategic/dual-use trigger missed	HS checked but technical parameter/end-use not checked	Compliance/legal exposure	Decree 259 + detailed-list review	Before acceptance/export
Origin PSR not met	Imported die/substrate/driver IC without evidence	Preference loss/origin verification	Origin Audit Trail + RVC/CTSH test	Pre-C/O
ESD/moisture damage	Packing ignores MSL/ESD	Latent failure/buyer claim	Packing instruction + evidence	Cargo Ready
Lot/date-code mismatch	Warehouse mixing / weak master data	Buyer rejection/traceability failure	Lot-package-invoice matrix	Packing/post-shipment
Missed cut-off / B/L discrepancy	Late booking/customs/SI	Roll/rebooking/payment delay	Milestone owner + document cross-check	Pre-ETD

14. FAQ

1. Does “Power module” have one fixed HS code?

No. IGBT/MOSFET, thyristor, diode, IPM and static-converter modules can follow different HS routes. Use datasheet, circuit/block diagram and principal function.

2. What HS can be reviewed for an IGBT power module?

Where the item is essentially an “other transistor” module, 8541.29.00 is a reference. Exact architecture still controls the final classification.

3. Does a DC-DC “power module” use 8541.29?

Not automatically. A complete DC-DC static converter should be reviewed under the 8504.40 family.

4. Does every Power module entering Hong Kong need a strategic licence?

No. A licence applies only where the exact item falls within the Cap.60G schedules. TID Pre-Classification can be used when the technical status is uncertain.

5. Does every Power module exported to China require China-RoHS conformity assessment?

No universal answer. Order No.32/FAQ can cover supporting components, while the 2026 Catalogue conformity layer applies to listed catalogue products. Map the exact supplied product.

6. Does a bare Power module exported to Korea require KC?

Do not assume so. Bare semiconductor modules differ from complete power supplies/UPS/static converters that may appear in Korean electrical-safety categories.

7. Is an SiC/GaN power module automatically dual-use?

No. Strategic control depends on exact product form, technical parameters and end-use/end-user. Substrates/materials and finished modules must not be treated as the same item.

8. What is the RCEP rule for 8541.29/8541.30?

Under Annex 3A HS2012, both use CTSH or RVC40. Map the current HS into the RCEP nomenclature first.

9. What is difficult in a Power-module origin file?

Origin evidence for dies, substrate, baseplate/ceramic, driver IC, leadframe/package and the assembly/test production trail. Supplier declarations and batch traceability matter.

10. What should be retained after on-board?

Customs, C/O/Origin Audit Trail, compliance/strategic classification, CoC/reliability tests, lot/date-code map, packing evidence, final transport docs, buyer/bank, payment and claims.

15. POST-SHIPMENT OUTPUTS & RECORDS

Completed export declaration and technical classification file.
Final B/L, Sea Waybill or AWB.
C/O/proof of origin and Origin Audit Trail where FTA preference is claimed.
China RoHS/material records by scope; Hong Kong TID pre-classification/licence where triggered; Korea safety/KC records where the exact item is regulated complete equipment.
Datasheet, CoC, reliability/test report, lot/date-code and manufacturer/part-number traceability.
ESD/MSL packing evidence, package/weight records, SI/VGM and transport records.
Buyer/bank set, payment evidence, L/C presentation, debit/credit and claim/survey records.
Engineering Change Notice where die, substrate, driver IC, package or model revision changes after compliance/origin has been locked.

TGIMEX IMPLEMENTATION SUPPORT

For Power modules, the hard part is not one customs declaration but keeping one controlled data chain across architecture → HS → market compliance → strategic screening → origin → lot → shipment.

Exact-model product-scope, HS and export-policy review.
China/Hong Kong/Korea Market Access and strategic/compliance trigger review.
FTA, PSR, BOM and Origin Audit Trail review.
Invoice – PL – customs – C/O – SI/VGM – B/L/AWB – part-number/lot reconciliation.
Booking, ESD/MSL packing, customs, cut-off and post-shipment coordination.

ELECTRICAL – ELECTRONICS – IT EQUIPMENT

F&B

MACHINERY

HOUSEHOLD GOODS

COSMETICS – PERSONAL CARE

ELECTRICAL – ELECTRONICS – IT EQUIPMENT

F&B – FOOD & BEVERAGE

MACHINERY

HOUSEHOLD GOODS

COSMETICS – PERSONAL CARE

EXPORTING POWER MODULES FROM VIETNAM

1. QUICK FACTS

2. SCOPE & POWER-MODULE CLASSIFICATION

3. EXPORT MARKETS & MARKET ACCESS

3.1. REPRESENTATIVE-FAMILY MARKET SCAN

4. VIETNAM EXPORT POLICY

5. HS CODE – EXPORT DUTY – EXPORT VAT

5.1. REFERENCE HS MATRIX BY MODULE ARCHITECTURE

5.2. EXPORT DUTY

5.3. EXPORT VAT

6. C/O – FTA – RULES OF ORIGIN

7. POWER MODULE × MARKET SPECIALIZED COMPLIANCE

7.1. CHINA RoHS – COMPONENT SCOPE IS NOT THE SAME AS CATALOGUE CONFORMITY

7.2. HONG KONG – STRATEGIC PRE-CLASSIFICATION BEFORE BOOKING

7.3. KOREA – COMPONENT VERSUS COMPLETE POWER SUPPLY

8. EXPORT DOCUMENT SET & SUBMISSION CHANNEL

9. LEGAL / REGULATORY MATRIX – THREE LAYERS

10. E2E EXPORT WORKFLOW

PRODUCT SCOPE + MARKET SCAN

HS – POLICY – FTA/ORIGIN

CONTRACT + BUYER REQUIREMENTS

COMPLIANCE + TRACEABILITY

BOOKING – PACKING – TRUCKING

EXPORT DECLARATION

SI – VGM – CY/CFS – LOADING

ORIGIN – FINAL DOCS – BUYER/BANK – ARCHIVE

11. PRE-ETD / CARGO READY / CUT-OFF TIMELINE

12. INCOTERMS – TRANSPORT – PACKING – COST

INCOTERMS – RISK ≠ COST

13. RISKS & CONTROL POINTS

14. FAQ

1. Does “Power module” have one fixed HS code?

2. What HS can be reviewed for an IGBT power module?

3. Does a DC-DC “power module” use 8541.29?

4. Does every Power module entering Hong Kong need a strategic licence?

5. Does every Power module exported to China require China-RoHS conformity assessment?

6. Does a bare Power module exported to Korea require KC?

7. Is an SiC/GaN power module automatically dual-use?

8. What is the RCEP rule for 8541.29/8541.30?

9. What is difficult in a Power-module origin file?

10. What should be retained after on-board?

15. POST-SHIPMENT OUTPUTS & RECORDS

RELATED ARTICLES

HS classification principles

Export E2E workflow

TGIMEX IMPLEMENTATION SUPPORT

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