BARE PCB EXPORT GUIDE FROM VIETNAM
A Bare PCB is a printed circuit board without mounted active or passive components. The main control point is not the word “PCB”, but the distinction between bare board and PCBA, the layer count used for HS classification, and origin evidence required by the destination market.
This guide uses actual HS 8534 trade flows and compares China, Korea, Hong Kong, Japan and Thailand, then follows classification, origin, buyer compliance, packing and shipping controls through post-shipment.
1. QUICK OVERVIEW
2024 mirror-import data show China, Korea, Hong Kong, Japan and Thailand as the five largest destinations for HS 853400 from Vietnam.
New unpopulated bare boards generally follow the normal export route, subject to separate screening for scrap/waste, dual-use or special triggers.
Heading 85.34; indicative 8-digit codes: 8534.00.10 / .20 / .30 / .90 for single-sided, double-sided, multilayer and other.
RCEP can be reviewed for China/Korea/Japan; ATIGA/RCEP for Thailand; AHKFTA for Hong Kong. RCEP PSR for 8534.00: CTH or RVC40.
Do not automatically impose CE/KC/PSE on a bare component. Focus on material declarations, restricted substances, buyer specs and end-use.
Freeze lot, quantity, package, GW/NW, origin evidence, SI and VGM before cut-off.
Air for urgent/high-value boards; Sea for stable volume. Protect against moisture, oxidation, warpage and surface damage.
2. PRODUCT SCOPE & CLASSIFICATION
This guide covers new, unpopulated printed circuit boards. It does not cover assembled PCBA, complete mainboards, functional modules, PCB scrap/waste or used boards.
| Variant | What to verify | Technical evidence | HS / trigger | Application note |
|---|---|---|---|---|
| Single-sided rigid PCB | One conductive side; substrate type | Drawing, stack-up, material spec, finish | 8534.00.10 if facts match | Never classify only by trade name. |
| Double-sided PCB | Two conductive sides; plated through-holes where relevant | Layer map, drill file, finish | 8534.00.20 | Vias, plated through-holes or edge-finger/contact pads do not by themselves turn the board into PCBA; a mounted connector/component requires the product scope to be re-checked. |
| Multilayer / HDI PCB | Three or more conductive layers; blind/buried/microvia where relevant | Stack-up, copper thickness, impedance/via data | 8534.00.30 | Customs advance rulings on similar bare multilayer boards support this logic but are not universal precedents. |
| Flex / rigid-flex / metal-core | PI flex, rigid-flex, aluminium/copper core | Construction/BOM/material spec | Do not default to .90; review .10/.20/.30/.90 by sidedness/layer count and actual construction | Flex, rigid-flex and metal-core boards may still be single-sided, double-sided or multilayer; use .90 only when the facts do not fit those branches. |
| PCBA / assembled board | Mounted functional components | Component BOM, schematic, function | May fall outside 85.34 | Separate classification is required. |
3. EXPORT MARKETS & MARKET ACCESS
WITS/UN Comtrade mirror-import data for HS 853400 – Printed circuits in 2024 show imports from Vietnam of approximately USD 555.12m into China, 398.85m into Korea, 353.21m into Hong Kong, 169.34m into Japan and 165.13m into Thailand. As demand is distributed across several Asian electronics hubs, this article remains a multi-market guide.
| Market | Fit | Market-access review | Product/company expectations | Data to prepare |
|---|---|---|---|---|
| China | High | Check importer/end-use and material/EEE rules if the board itself is placed on the market; do not assume a standalone certification requirement. | Restricted-substance data, lot traceability, stack-up/finish/impedance per buyer. | Invoice/PL, drawing, COC, material declaration, origin file. |
| Korea | High | Distinguish component from complete equipment; do not assume KC/RRA for a passive bare board. | IPC/quality controls, material data, supplier/lot traceability. | Drawing, inspection report, chosen origin route. |
| Hong Kong | High | Often part of electronics/re-export supply chains; freeze buyer/importer and origin representations. | Quality, lot, packing and origin evidence. | Invoice/PL, COC, origin file, marks. |
| Japan | High | Do not assume PSE applies to an unpowered bare PCB; screen the end-use and buyer requirements. | Tight copper/finish/warpage/impedance control; buyer may specify JPCA/IPC. | Inspection data, drawing revision, origin route. |
| Thailand | High | Check if the finished product or board scope falls under a compulsory standard; do not assume TISI applies to every bare component. | Buyer quality data, lot traceability, humidity/oxidation protection. | Invoice/PL, COC, ATIGA/RCEP origin file if used. |
4. VIETNAM EXPORT CONDITIONS / POLICY
New commercial Bare PCB
New unpopulated Bare PCB normally follows the ordinary export route once HS, description and source documentation are locked, provided no special end-use/product trigger applies.
As of 28 Aug 2026, Decree 69/2018/ND-CP remains the baseline. Decree 292/2026/ND-CP becomes effective on 5 Sep 2026 and replaces Decree 69.
Screen model, new/used condition, end-use, buyer/destination and applicable control lists before booking.
5. HS CODE – EXPORT DUTY – EXPORT VAT
| Variant | Indicative HS | Classification basis | Export duty | Export VAT | Evidence |
|---|---|---|---|---|---|
| Single-sided bare PCB | 8534.00.10 | Printed circuit – single-sided | Check current Export Tariff Annex I after final HS | Review 0% conditions and proof | Drawing/layer count/material |
| Double-sided bare PCB | 8534.00.20 | Printed circuit – double-sided | Same approach | Same approach | Layer map/finish/drilling |
| Multilayer bare PCB | 8534.00.30 | Printed circuit – multilayer | Same approach | Same approach | Stack-up/copper/via spec |
| Other bare printed circuit | 8534.00.90 | Where the facts do not fit the three branches | Same approach | Same approach | Construction/material/end-use |
Export duty
Conclusion: do not publish an export-duty rate from the trade name alone. Verify the final 8-digit code against Decree 26/2023/ND-CP and current amendments, including Decree 201/2026 effective 23 Jul 2026.
Export VAT
Conclusion: “export = 0% VAT” is not automatic. Decree 181/2025/ND-CP sets the 0% rate in Article 17 and conditions in Article 18, subject to amendments including Decree 359/2025 and Decree 144/2026 effective 20 Jun 2026. Validate contract, payment and export evidence.
6. C/O – FTA – RULES OF ORIGIN
Origin must be built from the material BOM and actual production route: laminate/prepreg, copper foil, solder mask, surface-finish chemistry, imaging/etching/plating, drilling, lamination and final inspection.
| Destination | FTA options to review | Origin proof | PSR / rule | Control point |
|---|---|---|---|---|
| China | RCEP; compare ACFTA where relevant | Appropriate proof under selected FTA | RCEP 8534.00: CTH or RVC40 | Imported semi-finished PCB under heading 85.34 may fail a CTH route. |
| Korea | RCEP; compare VKFTA/AKFTA | Per selected agreement | RCEP: CTH or RVC40 | Choose based on tariff benefit and evidence burden. |
| Japan | RCEP; compare VJEPA/AJCEP | Per selected agreement | RCEP: CTH or RVC40 | Freeze criterion before C/O issuance. |
| Thailand | ATIGA or RCEP | Appropriate proof | Check current HS 8534 rule | Compare tariff, rule and transport conditions. |
| Hong Kong | AHKFTA if applicable and useful | AHKFTA origin proof | Check current HS rule | Do not assume re-export via Hong Kong automatically gets preference. |
Origin Audit Trail
- BOM/material consumption by board revision.
- Purchase invoices, import declarations and supplier declarations.
- Production routing and batch records.
- RVC worksheet when using the RVC route.
- Input C/O where cumulation is relied on.
7. PRODUCT-SPECIFIC COMPLIANCE
| Trigger | Potential requirement | When triggered | Control |
|---|---|---|---|
| True bare PCB | Usually no standalone technical export licence solely because it is a bare board | No active/radio/power function and no special list trigger | Keep technical evidence proving the unpopulated state. |
| Restricted substances | Buyer declarations/testing; downstream EU RoHS/REACH evidence | Market, end-product or buyer requires material compliance | Supplier declarations + risk-based testing. |
| EU article/SVHC | REACH Article 33 information plus SCIP notification data for the relevant EU duty holder where Candidate List SVHC exceeds 0.1% w/w | Board/article is placed on EU market and threshold is exceeded | Exporter supplies composition/SVHC data; the EU supplier/importer separately assesses Article 33 communication duties and SCIP notification duties under the Waste Framework Directive. |
| Waste/scrap/used PCB | Environmental/waste controls | Shipment is waste, scrap or used board | Separate policy workflow. |
| Special end-use | Export-control/dual-use screening | End-user/end-use/design falls within a controlled list | End-user screening and current-list review. |
8. EXPORT DOCUMENT SET & FILING
| Document group | Documents | Used at | Typical owner | Core data match | Common error |
|---|---|---|---|---|---|
| Commercial | Contract/PO, Invoice, Packing List | Customs/booking/buyer | Sales/Docs | Part no., revision, qty, value, Incoterm | Description too generic; revision mismatch. |
| Technical/HS | Drawing, stack-up, layer count, material/finish, photos | Classification/customs | Engineering/QA | Unpopulated status, layer count, dimensions | PCBA declared as bare PCB. |
| Origin | C/O if used, BOM, routing, supplier files, RVC worksheet | FTA/origin | Docs/Factory/Procurement | HS, criterion, invoice, lot | Missing supplier evidence. |
| Quality/compliance | COC, inspection, material/restricted-substance data where required | Pre-Cargo Ready/buyer | QA/Compliance | Lot, part no., finish, revision | Report covers wrong lot/revision. |
| Transport | Booking, SI, weight/VGM data according to booking scope, B/L/AWB, marks | Shipping/post-shipment | Forwarder/Docs | Packages, GW/NW, parties | Weight/marks mismatch; missed cut-off. |
Checklist before Cargo Ready
- Part number + drawing revision.
- Layer count + stack-up + copper thickness.
- Surface finish: HASL/ENIG/OSP/Immersion Tin/Silver, as applicable.
- Impedance/tolerance/warpage if controlled by the buyer.
- Lot/date code and quantity aligned with the PO.
- COC/inspection/material declaration required by market or buyer.
- Origin file sufficient for the selected FTA/C/O route.
9. LEGAL / REGULATORY MATRIX
| Layer | Instrument/source | Authority | Effective timing | Relevant section | Application | Old → new |
|---|---|---|---|---|---|---|
| Vietnam – foreign trade | Decree 69/2018/ND-CP | Government | Applicable on 28 Aug 2026 | Foreign-trade scope | Export restrictions/licensing review | Replaced by Decree 292 from 5 Sep 2026 |
| Vietnam – foreign trade | Decree 292/2026/ND-CP | Government | 5 Sep 2026 | Articles 64–65 | New foreign-trade framework | New |
| Vietnam – export duty | Decree 26/2023 + amendments incl. Decree 201/2026 | Government | 201 effective 23 Jul 2026 | Export Tariff Annex I | Rate checked only after final 8-digit HS | Current amended tariff |
| Vietnam – VAT | Decree 181/2025 + 359/2025 + 144/2026 | Government | 144 effective 20 Jun 2026 | Articles 17–18 and amendments | 0% only if conditions are satisfied | 181 → 359 → 144 |
| FTA – RCEP | Circular 05/2022 amended by Circular 32/2022 | MOIT | HS2022 PSR from 1 Jan 2023 | PSR 8534.00 | CTH or RVC40 | HS2022 update |
| FTA – EVFTA | Circular 14/2026/TT-BCT | MOIT | 10 May 2026 | PSR / EUR.1 annexes | EU preference if origin conditions are met | Replaces Circulars 11/2020 & 41/2022 |
| EU – substances | RoHS / REACH-SCIP official guidance | EC / ECHA | Role/product dependent | Scope / article obligations | Restricted-substance and SVHC data | Use current Candidate List |
10. E2E EXPORT PROCESS – 8 STEPS
The process uses the required vertical timeline. Product-specific gates are bare vs PCBA → layer count/HS → origin → buyer quality/material evidence → packing → cut-offs → audit trail.
Product scope + market scan
Confirm new/unpopulated status, rigid/flex/metal-core construction, layer count, finish, revision and end-use; select target markets using HS 8534 flows and buyer intent.
HS – policy – FTA/C/O
Create the technical classification file and choose 8534.00.10/.20/.30/.90 from the actual construction; compare origin routes by market.
Contract + buyer requirements
Freeze part/revision, stack-up, copper, finish, impedance/tolerance, IPC class where applicable, Incoterm, payment and document deliverables.
Quality / compliance completion
Complete outgoing inspection, COC, material/restricted-substance declarations and origin evidence for the exact lot.
Booking – packing – trucking
Choose Air/Sea; protect surface finish with interleaving/rigid support and moisture barrier/vacuum/desiccant where required; review ISPM 15 for wood packaging.
Export customs declaration
Use a sufficiently specific description: bare printed circuit board, layer count, unpopulated status and relevant material/use; cross-check commercial, technical and origin files.
SI – VGM – CY/CFS cut-offs – loading
Freeze shipper/consignee, packages, GW/NW, marks and B/L/AWB data; cross-check C/O shipment fields before release.
Final documents + archive
Issue final transport docs, C/O if used, buyer quality/bank set, and archive origin and claim evidence by lot/shipment.
11. PRE-ETD / CARGO READY / CUT-OFF TIMELINE
| Milestone | What to freeze | Evidence/data | Owner | Delay risk |
|---|---|---|---|---|
| Before Contract | Scope, preliminary HS, market/FTA, buyer spec, Incoterm/payment | Drawing/sample spec/buyer list | Sales/Engineering/Compliance | PO accepted although origin/spec cannot be met. |
| Before production freeze | Revision, stack-up, material source, origin route | BOM/routing/supplier files | Engineering/Procurement | Material change invalidates origin/testing. |
| Before Cargo Ready | COC/inspection, material data, lot, packing, booking | COC/test/packing/origin file | QA/Docs/Forwarder | Cargo ready but exact-lot evidence missing. |
| Before CY/CFS cut-off | Customs, trucking, gate-in/CFS | Declaration/booking/package/GW | Ops/Customs | Roll/rebooking/storage. |
| Before SI/VGM cut-off | B/L fields and weight | SI/VGM/parties/marks | Docs/Forwarder | Amendment/discrepancy. |
| After on-board | Final transport docs, C/O, buyer/bank set, archive | B/L/AWB, C/O, COC, payment docs | Docs/Finance/QA | Payment delay or origin verification failure. |
12. INCOTERMS – TRANSPORT – PACKING – COST
| Item | Bare PCB approach | Control point |
|---|---|---|
| Incoterm | FCA is usually the cleaner fit for Air/road or terminal delivery; FOB is only for sea/inland-waterway shipments when delivery occurs on board. EXW/DAP/CIP depend on contract and mode. | Separate risk transfer from freight/local-charge allocation. |
| Air | Samples, urgent production, high-value HDI/multilayer. | Volumetric weight, carton strength, moisture protection. |
| Sea LCL/FCL | Large stable programs and cost-sensitive cargo. | Moisture/oxidation, consolidation damage, pallets/crates; VGM follows packed-container responsibility, while for LCL the consolidator normally finalises container VGM. |
| Packing | Interleaf/protective film, rigid support, moisture barrier/vacuum, desiccant; ISPM 15 for in-scope wood. | Prevent pad/finish scratches and warpage. |
| Cost | Testing/compliance, C/O, packing, trucking, customs, local charges, freight, insurance, amendment/rebooking. | Do not publish absolute charges without a shipment quote. |
Transport-quality nuances
- ENIG, OSP and other finishes have different shelf-life/storage controls under the agreed product specification.
- HDI/fine-line boards require particular control of warpage, edge/corner protection and surface cleanliness.
- Do not treat Bare PCB as DG by default; screen separately if the shipment includes chemicals, batteries or other dangerous materials.
13. RISKS & CONTROL POINTS
| Risk | Root cause | Impact | Control | Timing |
|---|---|---|---|---|
| Bare PCB mistaken for PCBA | Generic description or mounted components | Wrong HS/policy/C/O | Photos + BOM + drawing + unpopulated statement | Pre-contract/classification |
| Wrong layer count | No stack-up/layer map | Wrong 8-digit code | Technical classification file | Before customs |
| Origin rule failure | Input HS/origin or RVC evidence missing | Preference lost/verification | BOM + supplier HS/origin + CTH/RVC test | Before C/O |
| Buyer quality rejection | Finish/impedance/warpage not tied to revision | Claim/rework/line stop | Golden spec + exact-lot inspection | Before Cargo Ready |
| Oxidation/moisture/scratch | Weak packing | Solderability/surface defect downstream | MBB/vacuum/desiccant/support | Packing |
| EU material-data gap | SVHC/restricted-substance data unmanaged | Importer/buyer compliance gap | Supplier declarations + targeted testing | Pre-contract/Cargo Ready |
| Missed cut-off / doc mismatch | Booking changes or SI/C/O/PL inconsistency | Roll/amendment/payment delay | Milestone + document cross-check | Before cut-off |
| Origin audit gap | BOM/routing/supplier records not archived | C/O cannot be substantiated later | Shipment-based audit trail | Post-shipment |
14. FAQ
Can Bare PCB be exported from Vietnam?
Generally yes for new unpopulated boards under the ordinary export route, subject to product/end-use screening and the rules effective on the shipment date.
What HS code is normally reviewed?
Heading 85.34; 8534.00.10 single-sided, .20 double-sided, .30 multilayer and .90 other, subject to technical confirmation.
Is a PCB with a few mounted components still a Bare PCB?
Do not assume so. Mounted components may change the product nature and classification.
Can RCEP be used for China, Korea or Japan?
Potentially, if all conditions are met. RCEP PSR for 8534.00 is CTH or RVC40.
Which C/O is relevant for Hong Kong?
AHKFTA can be reviewed if applicable and beneficial; do not request a certificate without checking the importer tariff and origin rule.
Does Bare PCB exported to the EU automatically require CE?
No blanket conclusion should be made from the name alone. Determine whether it is a component or standalone EEE and assess the downstream product/regulation.
Is RoHS testing mandatory for every lot?
Not automatically for every Bare PCB lot. Testing frequency should follow market/buyer scope, material-change controls and risk.
Air or Sea?
Air suits urgent/high-value boards; Sea suits larger stable volumes. Compare lead time, freight and moisture/oxidation risk.
Do samples still need customs data?
Depending on value and shipping route, customs treatment varies, but the goods description/value and required compliance/origin data must remain accurate.
What should be archived after shipment?
Declaration, Invoice/PL, final B/L/AWB, C/O if used, COC/inspection/material declarations, PO/contract, payment documents and the Origin Audit Trail.
15. FINAL OUTPUT & POST-SHIPMENT ARCHIVE
- Completed export declaration plus the technical classification file.
- Final B/L/AWB/Sea Waybill and booking/cut-off records.
- C/O/origin proof and Origin Audit Trail where a preference is used.
- COC, inspection and restricted-substance/material declarations required by buyer/market.
- Contract/PO, Invoice, Packing List and payment file.
- Claim/survey/8D/CAPA records if issues arise.
- Archive by part number + revision + lot + shipment.
FOOTNOTES / OFFICIAL SOURCES
- WITS / UN Comtrade mirror-import data for 2024, HS 853400 – Printed circuits from Vietnam.
- Vietnam Trade Portal – HS 85.34 nomenclature and RCEP PSR for 8534.00.
- Decree 69/2018/ND-CP and Decree 292/2026/ND-CP.
- Decree 26/2023/ND-CP and Decree 201/2026/ND-CP.
- Decree 181/2025/ND-CP, Decree 359/2025/ND-CP and Decree 144/2026/ND-CP.
- Circular 14/2026/TT-BCT – EVFTA rules of origin.
- European Commission – RoHS; ECHA – Article 33/Candidate List and SCIP information requirements.
EXPORT OPERATING CONTROL
For Bare PCB, lock five data layers early: product scope – HS – origin – buyer quality/compliance – shipment milestones. One shipment master data sheet should keep PO, Invoice, Packing List, COC, C/O, SI and B/L/AWB aligned.
- Confirm Bare PCB versus PCBA and final HS before accepting booking data.
- Review market access plus FTA/PSR for the actual destination.
- Check BOM, routing and supplier evidence to build the Origin Audit Trail.
- Freeze packing, Cargo Ready, SI/VGM/CY-CFS cut-offs and the post-shipment file.
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